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Monte-Carlo simulation of electromigration failure distributions of submicron contacts and vias: a new extrapolation methodology for reliability estimate

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2 Author(s)
Huang, J.S. ; Lucent Technol. Bell Labs., Orlando, FL, USA ; Oates, A.S.

We have studied the electromigration failure distributions as a function of current density, and we show experimentally that the forms deviate from lognormal distributions as j approaches critical current density. The form change in failure distributions can be well described by Monte-Carlo simulation based on our physical electromigration failure model. The model predicts that median time to fail (MTF) and failure time dispersion (σ) approach infinity as j→jc, and we show that this behavior results from a change in the functional form of failure with current density as j→jc. We propose a new methodology for the extrapolation of contact and via electromigration data to account for the change in the form of the failure distribution

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Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International

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