Cart (Loading....) | Create Account
Close category search window

Application considerations for high resistance ground retrofits in pulp and paper mills

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Beltz, R. ; Cutler-Hammer, Atlanta, GA, USA ; Peacock, I. ; Vilcheck, W.

Safety and reliability of low voltage-high resistance grounding (HRG) schemes have made them an excellent choice for application in the pulp and paper and other process industries. As facilities shift toward this technology for low voltage substations for improved reliability, retrofitting existing grounded systems requires several critical application considerations. This paper briefly reviews different grounding methods and their theory of operation. Then, examples of actual installations are presented that will identify potential misapplications of high resistance ground retrofits, discuss what typical ground voltages and currents to expect, and present important considerations for reliable and safe installation of HRG equipment.

Published in:

Pulp and Paper Industry Technical Conference, 2000. Conference Record of 2000 Annual

Date of Conference:

19-23 June 2000

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.