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Mixed signal system design course development

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1 Author(s)
H. Tenhunen ; Electron. Syst. Design Lab., R. Inst. of Technol., Stockholm, Sweden

This paper covers the current curriculum approach to system level integration at Royal Institute of Technology. Our approach is system driven with systematic emphasis of interconnect centric issues in all design phases and abstraction levels. The overall curriculum provides physical, design process (methodology), and functional view of the complex electronic system. Our focus in this paper is to describe the motivation and the specific content of the physical or implementation view. The key feature is enhancing student's capability to build systematically multiple abstractions of the technology and physical issues and constraints for efficient conceptual co-design of ICs and packages and interconnect substrates and for design space exploration. A major effort in Mixed Signal System Design course is devoted for understanding the electrical design and technology issues and interactions of chip and package for complex gigascale integrated systems. The objectives of this new course package is to give Swedish electronics industries world class engineering resources in strategic areas for system integration to final HW/SW products. The overall program is also available as International M.Sc. Program starting fall term 2000

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Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Date of Conference: