Cart (Loading....) | Create Account
Close category search window

Conduction development in electrically conductive adhesives with a bimodal size distributed conducting and inert particles: effect of polydispersity

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Mikrajuddin, ; Fac. of Eng., Hiroshima Univ., Japan ; Shi, F.G. ; Okuyama, K. ; Kim, H.K.

A well known approach for reducing the electrical percolation threshold of an electrically conductive material is to mix the relatively small sized conducting fillers with the relatively large sized inert particles. The percolation limit in terms of the volume fraction of conducting particles is known to decrease with increasing ratio of the mean size between the small and large particles. However, both the small conducting and large inert particles rarely exist as monodispersed, rather, there is a respective size distribution for each of them. Such a size distribution is expected to affect the development of conductivity as well as the percolation threshold. The first theoretical model for considering such a size dispersity effect on the conduction development and the percolation limit is reported. It is shown that the present model not only includes all the previous ones for considering only the particle size ratio effect, it considers the respective role played by the ratio of mean particle size, the size dispersity and the volume fraction on the electrical conduction development and the percolation limit. The model suggests an innovative route for processing new conductive adhesives with ultralow percolation limits. Other implications for manufacturing electrically conductive adhesives are also discussed

Published in:

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.