By Topic

Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)

After conducting 3D integrated modeling of an Intel microprocessor, a distributed load current model represented the non-uniform power distribution on the chip is hooked up the on-chip interconnect. The on-chip interconnect is then tied to the integrated model. A multiple-phase, full synchronous switched dc/dc converter model is connected to the other end of the integrated model. Performance evaluation of the complete power delivery system based on a single and multiphase dc/dc converter is made. Advantages and disadvantages of each design are noted. Differences in the output characteristics with a simple source replacement of the dc source and with an actual voltage regulator module are highlighted

Published in:

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Date of Conference: