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Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems

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2 Author(s)
Se-Young Jang ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Kyung Wook Paik

The effect of a reflow process and under bump metallurgy (UBM) systems on the growth of intermetallic compounds for Sn/Bi and Pb/Sn solder bump/UBM interfaces was investigated. The UBM systems were sputtered Al/Ti/Cu, Al/Ti/electroless plated Cu, Al/NiV/sputtered Cu, Al/electroless plated Ni/Au, and the solder bumps were eutectic Pb/Sn and Bi/Sn fabricated by an electroplating method. Microstructure and composition of intermetallic compound (IMC) phases and their morphology were examined using scanning electron microscopy and X-ray diffraction. The IMC compounds were confirmed to be Cu6Sn5, Cu 3Sn, Ni3Sn4, or Ni3Sn depending on UBM and solder types. The effect of IMC growth on bump adhesion strength was also investigated using a ball shear test. It turns out that ball shear strengths of the systems depends not on processing conditions but on solder/UBM interfacial adhesion strength

Published in:

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Date of Conference:

2000