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Monolithic integration technology using InP-based HEMTs and a uni-traveling-carrier-photodiode for over 40 Gbit/s digital OEIC

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9 Author(s)
Kitabayashi, H. ; NTT Photonics Lab., Kanagawa, Japan ; Umeda, Y. ; Furuta, T. ; Watanabe, Noriyuki
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A uni-traveling-carrier photodiode (UTC-PD), featuring high-output power and a fast response, was monolithically integrated into a 0.1-μm-gate InP-based HEMT digital IC that can operate at over 40 Gbit/s. In the digital OEIC fabrication using our integration technology, the demultiplexing function of an optical-input D-type flip-flop (D-FF) circuit using 40-Gbit/s return-to-zero (RZ) optical signal and 20-GHz electrical clock signal was confirmed. This integration technology enables the development of a simplified receiver unit with high performance for use in 40-Gbit/s and over TDM systems

Published in:
Indium Phosphide and Related Materials, 2000. Conference Proceedings. 2000 International Conference on

Date of Conference: 2000

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