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Flip-chip solder bond mounting of laser diodes

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4 Author(s)
Edge, C. ; Plessey Res. Caswell Ltd., Towcester, UK ; Ash, R.M. ; Jones, C.G. ; Goodwin, M.J.

The successful hybrid mounting of semiconductor laser diode chips by flip-chip solder bonding is reported. This technique allows accurate chip placement with submicron positioning, and has demonstrated acceptable heat dissipation characteristics.

Published in:

Electronics Letters  (Volume:27 ,  Issue: 6 )

Date of Publication:

14 March 1991

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