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Advanced flip chip bonding techniques using transferred microsolder bumps

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4 Author(s)
Koshoubu, N. ; NTT Telecommun. Networks Labs., Tokyo, Japan ; Ishizawa, S. ; Tsunetsugu, H. ; Takahara, H.

For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which allows module packaging using processes at various temperatures because it has a higher melting temperature than 100% In and 60% Sn-Pb solders. The other uses multiple transfers of bumps to achieve accurate three-dimensional flip-chip bonding with precise vertical and horizontal alignments within an error of ±0.5 μm. These techniques will thus be very useful in developing high-speed and high-density OE-MCM's for multi-functional board-level interconnection in future optical communication systems

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 2 )

Date of Publication:

Jun 2000

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