Cart (Loading....) | Create Account
Close category search window


Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Kawahara, T. ; Fujitsu Labs. Ltd., Kawasaki, Japan

SuperCSP is fabricated by building up the interposer with high reliability encapsulant on the chip by wafer level packaging technology. New encapsulation technology enables real chip-sized package from a package perspective. It is also a known good encapsulated die (KGED) from a die perspective. The reasons why board level reliability of SuperCSP is good regardless of extremely low bump-standoff height are as follows. (1) The C.T.E of encapsulant for SuperCSP is close to that of motherboard, so that the encapsulant layer effectively reduces stress occurring in the solder interconnecting portion. (2) Encapsulant with high adhesive strength reinforces and fixes the delicate connecting portion of chip and post, and also does not allow its deformation. (3) Connecting portion of solder ball and post has a strong structure and can tolerate the stress because solder balls catch hold of the whole surface of metal posts, which stick out from the encapsulant and have a mound like structure

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )

Date of Publication:

May 2000

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.