By Topic

2 Gbit/s small form factor fiber-optic transceiver for single mode optical fiber

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Sunaga, Y. ; Optoelectron. Syst. Lab., Hitachi Cable Ltd., Ibaraki, Japan ; Takahashi, R. ; Tokoro, T. ; Kobayashi, M.

Small form factor (SFF) optical transceivers are expected to be commonly used in the near future for high-end (high bit-rate, single mode) applications as well as for low-cost applications. SFF optical transceivers require new packaging techniques for the optical portion, because the distance between input and output optical axes is much smaller than those of conventional transceivers, e.g., the “1by9” type. Two types of optical packaging are introduced, both of which are suitable for transceivers which have an MT-based receptacle for single mode applications. One of the packaging types, a fiber-bulk structure, takes full advantage in cost and reliability of standard, hermetically sealed TO-canned optical devices. A conventional TO-can packaged laser diode (LD) and photodiode (PD) are held with short optical fibers by low-cost, injection-molded polymer retainers. The short fibers are connected to an MT ferrule inside the transceiver. An alternative packaging type, a surface mount structure, is intended for drastic cost reduction in large volume production by using advanced highly integrated assembly. An LD chip with an integrated spot-size converter and a waveguide-structured PD chip are mounted on a Si-substrate. Optical coupling between the optical devices and fibers on V-groove is accomplished by passive alignment, which reduces assembling time. A prototype transceiver with an MPO receptacle has been developed using the former packaging structure. Evaluated results show performance which complies with the 2.125 Gbit/s Fiber Channel standard. SFF transceivers with these new packaging technologies are expected to increase the optical port density and also to reduce the cost of high-end systems with bit rate of 2 Gbit/s or higher per port

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )