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Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

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4 Author(s)
Elzinga, M. ; Intel Corp., Chandler, AZ, USA ; Virga, K.L. ; Li Zhao ; Prince, J.

As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high frequency interconnects are needed. In this paper, a new macromodeling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodeling tool that enables simulation of interconnects in a modified version of simulation program with integrated circuit emphasis (SPICE). This results in a method that conveniently incorporates accurate EM models of interconnects or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators

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Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )