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Sensitivity analysis of multiconductor transmission lines and optimization for high-speed interconnect circuit design

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4 Author(s)
Cheng Jiao ; Centre for Electron. Packaging Res., Arizona Univ., Tucson, AZ, USA ; Cangellaris, A.C. ; Yaghmour, A.M. ; Prince, J.

Sensitivity analysis of multiconductor transmission lines is derived from a new, all-purpose multi-conductor transmission line model in both frequency domain and time domain. Computer implementation of this new model as well as the sensitivity analysis has been completed. It enables efficient, accurate simulations of interconnect circuit responses as well as sensitivity analysis with respect to both electrical and physical transmission line parameters. By applying sensitivity analysis to high-speed interconnect circuit design, design variables are optimized to achieve simultaneous minimization of crosstalk, delays and reflections at desired nodes in the circuit without violating any indispensable design rules. Numerical examples are presented to demonstrate the validity of the proposed sensitivity analysis and illustrate its application to the optimization of high-speed interconnect circuit design

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Advanced Packaging, IEEE Transactions on  (Volume:23 ,  Issue: 2 )