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Thermal testing: fault location strategies

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5 Author(s)
Altet, J. ; Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain ; Rubio, A. ; Schaub, E. ; Dialhaire, S.
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By measuring the temperature at some points of an IC during a test procedure, defects can be detected (fault testing). With a simple processing of the measured temperature waveform, the distance between the temperature monitoring point and the activated defect can be derived. This paper presents four temperature measuring strategies to determine this distance for diagnosis purposes

Published in:

VLSI Test Symposium, 2000. Proceedings. 18th IEEE

Date of Conference:

2000

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