By Topic

HPC application in 3D parameter extraction and hard IP migration for DSM IC design

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Wenjun Zhuang ; Inst. of High Performance Comput., Singapore ; Han Yang Foo ; Qian Shi

Entering the era of deep sub-micron, Singapore has put a lot of effort into the development of design and manufacturing capability in the microelectronics industry. The Institute of High Performance Computing has invested in manpower, high-performance computing hardware, and state-of-the-art EDA CAD tools to assist and support local microelectronics industry in applications such as 3D parameter extraction and hard IP migration.

Published in:

High Performance Computing in the Asia-Pacific Region, 2000. Proceedings. The Fourth International Conference/Exhibition on  (Volume:2 )

Date of Conference:

14-17 May 2000