Referenced Items are not available for this document.
This paper describes the supporting structure of surface mount type crystal resonators suitable for operation at higher frequencies. This supporting structure applies gold bumps to bond a crystal chip to a ceramic package. The gold bump bonding is applied to AT-cut high frequency fundamental crystal resonators which have extremely thin vibrating parts. As a result, the effectiveness of gold bump bonding in heat-resistance, long-term stability, and conductive reliability are verified by the experimental characteristics of the above crystal resonators
Published in:
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
(Volume:1
)
Date of Conference: 1999
- Page(s):
- 461 - 464 vol.1
- Meeting Date :
- 13 Apr 1999-16 Apr 1999
- ISSN :
- 1075-6787
- Print ISBN:
- 0-7803-5400-1
- INSPEC Accession Number:
- 6615702
- Conference Location :
- Besancon
- Digital Object Identifier :
- 10.1109/FREQ.1999.840806
- Product Type:
- Conference Publications
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