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Quick on-chip self- and mutual-inductance screen

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3 Author(s)
Shen Lin ; Hewlett-Packard Co., Palo Alto, CA, USA ; Chang, N. ; Nakagawa, S.

In this paper, based on simulations of top-level interconnects and CMOS devices of industrial 0.18 μm technology, the rules to screen out those inductive interconnects requiring more accurate RLC considerations, and the victim wires potentially having significant inductive noises are developed. The presented criteria constitute a tighter self-inductance screening rule than those found in previously published work. The 2×mutual inductance screening rule is presented and verified. The differences in on-chip inductance consideration, the significant frequency of a trapezoidal pulse, and the circuit modeling of on-chip inductance are also discussed

Published in:

Quality Electronic Design, 2000. ISQED 2000. Proceedings. IEEE 2000 First International Symposium on

Date of Conference:

2000