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Fabrication of sub-micron structures with high aspect ratio for MEMS using deep X-ray lithography

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3 Author(s)
Ueno, H. ; Fac. of Sci. & Eng., Ritsumeikan Univ., Kyoto, Japan ; Nishi, N. ; Sugiyama, S.

In this paper, we present the fabrication of sub-micron structures with high aspect ratio for practical and high performance microelectromechanical systems (MEMS) using deep X-ray lithography. It is necessary for practical and high performance MEMS to be fabricated microstructures with sub-micron widths and gaps (lines and spaces). In order to fabricate the sub-micron microstructures, sub-micron deep X-ray lithography has been investigated. As a result, a sub-micron PMMA structure with 0.2 μm minimum width, 6 μm length and 17 μm height was fabricated by deep X-ray lithography using an X-ray mask with thick X-ray absorbers having sub-micron width

Published in:

Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on

Date of Conference:

23-27 Jan 2000