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Fabrication of buried corrugated waveguides by wafer direct bonding

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5 Author(s)
S. Pelissier ; Lab. Traitement du Signal et Instrum., Univ. Jean Monnet, Saint-Etienne, France ; G. Pandraud ; A. Mure-Ravaud ; A. V. Tishchenko
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A new fabrication method of deeply buried corrugated waveguides is presented. It uses a direct bonding process and allows us to make efficient grating couplers in waveguides. The efficiency of the grating is enhanced by enclosing air in its grooves during the fabrication process. A demonstrator based on a waveguide produced by ion exchange has been fabricated and tested. Theoretical and experimental results are compared.

Published in:

Journal of Lightwave Technology  (Volume:18 ,  Issue: 4 )