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Full software analysis and impedance matching of radio frequency CMOS integrated circuits

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8 Author(s)
Ki Hyuk Kim ; Dept. of Electron. Eng., Korea Univ., Seoul, South Korea ; Hoi Ju Chung ; Sung Ho Yoon ; Sung Woo Hwang
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We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (ICs). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique

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Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 1 )