Cart (Loading....) | Create Account
Close category search window
 

Adhesion and toughening mechanisms at underfill interfaces for flip-chip-on-organic-substrate packaging

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Xiang Dai ; Hewlett-Packard Co., Palo Alto, CA, USA ; Brillhart, M.V. ; Roesch, M. ; Ho, Paul S.

The flip chip-on-organic-substrate packaging technology utilizes a particulate reinforced epoxy as the underfill (UF) to adhere the chip to the package or board, Although the use of underfill encapsulation leads to improved reliability of flip-chip solder interconnections, delamination at various interfaces becomes a major concern for assembly yield loss and package reliability. In spite of their importance, the adhesion and fracture behaviors of the underfill interfaces have not been investigated until recently. Considerable controversy exists over the effects of underfill formulation and the adhesion and toughening mechanisms of the interfaces. The present work focuses on investigating the effects of several key variables on the interface adhesion strengths for UF/chip and UF/organic substrate systems. These variables are underfill organosilane content, filler particle content, rubber particle content, surface morphology and chemistry of the chip and organic substrates. The approach of this study is to measure the effect of these variables on the interfacial fracture energy using the double-cantilever-beam (DCB) techniques. The results demonstrate that the underfill interfacial adhesion and fracture characteristics are controlled by several distinct but competing mechanisms, such as formation of primary bonds, crack-pinning by glass fillers, debonding of glass filler from epoxy matrix (defect formation), and cavitation and shearing induced by rubber particles. Fundamental understanding of the interfacial adhesion and toughening mechanisms can provide guidance for developing new processes and materials to enhance interfacial adhesion and reliability

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 1 )

Date of Publication:

Mar 2000

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.