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Advanced cooling system using miniature heat pipes in mobile PC

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6 Author(s)
T. Nguyen ; Fujkura Ltd., Tokyo, Japan ; M. Mochizuki ; K. Mashiko ; Y. Saito
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This paper describes various cooling solutions using heat pipes for cooling a notebook PC. These are: 1) heat pipe with heat spreader plate; 2) hybrid system-i.e., heat pipe with heat sink and fan; and 3) hinged heat pipe system. For heat input of less than 12 W, the thermal resistance measured between the surface of the CPU to ambient was obtained as follows: greater than 8°C/W for system 1) and 4-6°C/W for systems 2) and 3). For the CPU having specification of surface temperature of 95°C and 40°C ambient, then system 1) can be dissipated by about 6 W, whereas systems 2) and 3) can handle 13 W. Experimental results of these three systems are included and discussed in this paper

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 1 )