By Topic

Toward optimizing enhanced surfaces for passive immersion cooled heat sinks

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
C. S. Baldwin ; Intel Corp., Chandler, AZ, USA ; S. H. Bhavnani ; R. C. Jaeger

Reduction in die feature-size due to improvements in microelectronics fabrication technology have increased the demands on effective thermal management. As a consequence, innovative heat removal schemes need to be explored. Immersion cooling in a dielectric fluid, despite the increased complications, continues to be studied as a possible solution. The characteristics of a surface used as a pool boiling heat sink depend on its microscopic features. This paper reports results from an investigation in which the shape and spacing of these microscopic features were studied in order to achieve improved thermal performance. The heat sources were thin-film heaters deposited in an array on a silicon wafer which was immersed in PC-72

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:23 ,  Issue: 1 )