By Topic

Calibration of resistance type die level temperature sensors using a single temperature technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Solbrekken, G.L. ; Intel Corp., Chandler, AZ, USA ; Chia-pin Chiu

Thermal test chips are widely used to develop electronic packaging thermal solutions and to evaluate electronic package assembly processes. Temperature sensors are an integral component on thermal test chips. Unfortunately, each temperature sensor must be calibrated in order for them to be effective. Each calibration can take up to one hour to complete. In a time when increasing sample sizes and shorter development cycles are taxing current equipment and manpower resources, new calibration techniques must be established to keep development costs down. This paper discusses simplified calibration procedures, which can significantly reduce the time needed for temperature sensor calibration. The simplified calibration procedures utilize single-resistance measurements either at room temperature or at the anticipated test temperature. For four different test chip designs included in the current study, calibration error variations less than ±0.6°C at a ±2σ confidence level are possible. The simplified calibration procedures can be applied to any resistor type temperature sensor that has a linear correlation between its electric resistive properties and temperature

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:23 ,  Issue: 1 )