By Topic

Damaged depth in GaAs processed by Ar plasma etching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Hidaka, H. ; Optoelectron. Technol. Res. Lab., Tsukuba, Japan ; Akita, K. ; Taneya, M. ; Sugimoto, Y.

The damaged depths in GaAs processed by Ar plasma etching under various applied radio-frequency (RF) voltages and Ar pressures in a parallel-plate type apparatus were studied. The damaged depth was evaluated in terms of the chemically etched thickness at which the photoluminescence intensity recovers. The damaged depth decreased as the applied radio frequency peak voltage was decreased. The depth was extraordinarily deep in the lower radio frequency voltage region. The effect of Ar pressure on damaged depth was small in the range from 1 to 10 Pa.

Published in:

Electronics Letters  (Volume:26 ,  Issue: 15 )