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Design technique of broadband planar interconnects for co-layer multi-chip module (MCM) of microwave and millimeter-wave circuits

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2 Author(s)
J. B. Tang ; Dept. de Genie Electr., Ecole Polytech. de Montreal, Que., Canada ; K. Wu

We present a very effective but rather simple scheme of ribbon interconnects for applications in the broadband design of co-layer multi-chip module (MCM) of planar circuits at microwave and millimeter-wave frequencies. This new concept stems from the principle of sectional impedance matching. A field-based analysis and experimental verification have validated the proposed technique. Our work reported in the paper shows that excellent low-loss broadband performance could be achieved by using this simple and low-cost technique

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Microwave Conference, 1999 Asia Pacific  (Volume:1 )

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