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Failure analysis of solder bumped flip chip on low-cost substrates

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3 Author(s)
Lau, J.H. ; Express Packaging Syst. Inc., Palo Alto, CA, USA ; Chang, C. ; Lee, S.W.R.

Failure analyses of 63/37 Sn/Pb solder bumped flip chip assemblies with underfill encapsulant are presented in this study, Emphasis is placed on solder flowed-out, nonuniform underfill and voids, and delaminations. The X-ray, scanning acoustic microscope (SAM), and tomographic acoustic micro imaging (TAMI) techniques are used to analyze the failed samples. Also, cross sections are examined for a better understanding of the failure mechanisms. Furthermore, temperature dependent nonlinear finite element analyses together with fracture mechanics are used to determine the effects of underfill void sizes on the flip chip solder joint reliability

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:23 ,  Issue: 1 )