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Cost analysis: solder bumped flip chip versus wire bonding

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1 Author(s)
Lau, J.H. ; Express Packaging Syst. Inc., Palo Alto, CA, USA

The cost of wire bonding chips and solder bumped flip chips on boards or on organic substrates is studied. The effects of IC chip yields, gold and solder materials, and major equipment of these technologies on costs are examined. Useful equations and charts for determining the cost of and comparing the cost between these technologies are provided

Published in:

Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:23 ,  Issue: 1 )