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The thermal conductivities /spl kappa/ of the dielectric and conducting thin films of three commercial CMOS processes were determined in the temperature range from 120 to 400 K. The measurements were performed using micromachined heatable test structures containing the layers to be characterized. The /spl kappa/ values of thermally grown silicon oxides are reduced from bulk fused silica by roughly 20%. The /spl kappa/ of phosphosilicate and borophosphosilicate glasses are 0.94/spl plusmn/0.08 W m/sup -1/ K/sup -1/ and 1.18/spl plusmn/0.06 W m/sup -1/ K/sup -1/, respectively, at 300 K. A plasma-enhanced chemical-vapor-deposition silicon-nitride layer has a thermal conductivity of 2.23/spl plusmn/0.12 W m/sup -1/ K/sup -1/ at 300 K. This value is between published data for atmospheric-pressure CVD and low-pressure CVD nitrides. For the metal layers, we found thermal conductivities between 167 W m/sup -1/ K/sup -1/ and 206 W m/sup -1/ K/sup -1/, respectively, at 300 K, to be compared with 238 W m/sup -1/ K/sup -1/ of bulk aluminum. The temperature-dependent product /spl kappa//spl rho/ of /spl kappa/ with the electrical resistivity /spl rho/ agrees better than 8.2% between 180-400 K with that of pure bulk aluminum. The /spl kappa/ values of the polysilicon layers are between 22.4 W m/sup -1/ K/sup -1/ and 37.3 W m/sup -1/ K/sup -1/ at 300 K. They are reduced from similarly doped bulk silicon by factors of between 2.0-1.3. The observed discrepancies between thin film and bulk data demonstrate the importance of determining the process-dependent thermal conductivities of CMOS thin films.