By Topic

Micromachining of diamond film for MEMS applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Shibata, Takayuki ; Dept. of Electron. & Inf. Eng., Hokkaido Univ., Sapporo, Japan ; Kitamoto, Y. ; Unno, K. ; Makino, E.

We realized two diamond microdevices: a movable diamond microgripper and a diamond probe for an atomic force microscope (AFM), consisting of a V-shaped diamond cantilever and a pyramidal diamond tip, using a microfabrication technique employing semiconductive chemical-vapor-deposited diamond thin film. The microgripper was fabricated by patterning the diamond thin film onto a sacrificial SiO/sub 2/ layer by selective deposition and releasing the movable parts by sacrificial layer etching. The diamond AFM probe was fabricated by combining selective deposition for patterning a diamond cantilever with a mold technique on an Si substrate for producing a pyramidal diamond tip. The cantilever was then released by removing the substrate. We report the initial results obtained in AFM measurements taken using the fabricated diamond probe. These results indicate that this diamond probe is capable of measuring AFM images. In addition, we have developed the anodic bonding of diamond thin film to glass using Al or Ti film as an intermediate layer for assembly. This bonding technique will allow diamond microstructures to be used in many novel applications for microelectromechanical systems.

Published in:

Microelectromechanical Systems, Journal of  (Volume:9 ,  Issue: 1 )