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Micromachining of diamond film for MEMS applications

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4 Author(s)
Shibata, Takayuki ; Dept. of Electron. & Inf. Eng., Hokkaido Univ., Sapporo, Japan ; Kitamoto, Y. ; Unno, K. ; Makino, E.

We realized two diamond microdevices: a movable diamond microgripper and a diamond probe for an atomic force microscope (AFM), consisting of a V-shaped diamond cantilever and a pyramidal diamond tip, using a microfabrication technique employing semiconductive chemical-vapor-deposited diamond thin film. The microgripper was fabricated by patterning the diamond thin film onto a sacrificial SiO/sub 2/ layer by selective deposition and releasing the movable parts by sacrificial layer etching. The diamond AFM probe was fabricated by combining selective deposition for patterning a diamond cantilever with a mold technique on an Si substrate for producing a pyramidal diamond tip. The cantilever was then released by removing the substrate. We report the initial results obtained in AFM measurements taken using the fabricated diamond probe. These results indicate that this diamond probe is capable of measuring AFM images. In addition, we have developed the anodic bonding of diamond thin film to glass using Al or Ti film as an intermediate layer for assembly. This bonding technique will allow diamond microstructures to be used in many novel applications for microelectromechanical systems.

Published in:

Microelectromechanical Systems, Journal of  (Volume:9 ,  Issue: 1 )