Scheduled System Maintenance:
On Monday, April 27th, IEEE Xplore will undergo scheduled maintenance from 1:00 PM - 3:00 PM ET (17:00 - 19:00 UTC). No interruption in service is anticipated.
By Topic

Optimization of cycle time and utilization in semiconductor test manufacturing using simulation based, on-line, near-real-time scheduling system

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Sivakumar, A.I. ; Gintic Inst. of Manuf. Technol., Nanyang Technol. Inst., Singapore

A discrete event simulation based “on-line near-real-time” dynamic scheduling and optimization system has been conceptualized, designed, and developed to optimize cycle time and asset utilization in the complex manufacturing environment of semiconductor test manufacturing. Our approach includes the application of rules and optimization algorithm, using multiple variables as an integral part of discrete event simulation of the manufacturing operation and auto simulation model generation at a desired frequency. The system has been implemented at a semiconductor back-end site. The impact of the system includes the achievement of world class cycle time, improved machine utilization, reduction in the time that planners and manufacturing personnel spend on scheduling, and more predictable and highly repeatable manufacturing performance. In addition it enables managers and senior planners to carry out “what if” analysis to plan for future

Published in:

Simulation Conference Proceedings, 1999 Winter  (Volume:1 )

Date of Conference: