Referenced Items are not available for this document.
Polyimide resins that have been developed and marketed for semiconductor applications by Japanese companies are reviewed. Test results for devices in which polyimide resins are used as the interlayer insulator, alpha-ray shielding, or buffer coating film are presented. The status of the development of new polyimides for semiconductors is discussed.<
Published in:
Electrical Insulation Magazine, IEEE
(Volume:4
,
Issue:
2
)
Date of Publication: March-April 1988
- Page(s):
- 15 - 23
- ISSN :
- 0883-7554
- INSPEC Accession Number:
- 3191753
- Digital Object Identifier :
- 10.1109/57.822
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- March-April 1988
- Sponsored by :
- IEEE Dielectrics and Electrical Insulation Society
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