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Integrated micro heat sink for power multichip module

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3 Author(s)
Gillot, C. ; Lab. d''Electromech. de Grenoble, ENSIEG, Saint Martin d''Heres, France ; Schaeffer, C. ; Bricard, A.

Today, more and more compact converters with high current are required. The thermal environment is a key point to meet these requirements: the heat sink must be integrated as closely as possible to heat sources. Liquid-cooled microchannel heat sinks are very efficient and well adapted to the cooling of power components. Thus, a high-performance micro heat sink was made and tested under a power multichip module. First, the principle of the microchannel heat sink and a three-dimensional approach are presented. Then, a prototype and results are described. Composed of eight insulated gate bipolar transistor chips, the prototype has a current rating as high as 1200 A

Published in:

Industry Applications, IEEE Transactions on  (Volume:36 ,  Issue: 1 )