Cart (Loading....) | Create Account
Close category search window

An integrated environment for the simulation of electrical, thermal and electromagnetic interactions in high-performance integrated circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Gutierrez, H.M. ; Div. of Eng. Sci., Florida Inst. of Technol., Melbourne, FL, USA ; Christoffersen, C.E. ; Steer, M.B.

Joint computer simulation of circuit, thermal and electromagnetic interactions in high performance integrated circuits and systems is of particular importance for the modeling of electronic packaging, since packages are complex coupled systems where all of these aspects interact in a dynamic sense. This paper describes a computer environment that supports the simultaneous simulation of thermal, electromagnetic and circuit interactions in complex microwave circuits. Locally referenced modules have been used to enable disparate modeling tools to interact, and suggest possible paths to include mechanical interactions in the future. Two methods are presented for the simulation of electro-thermal interaction. The first is based on coupling of electrical and thermal environments using a lumped-parameter model of the heat dissipation dynamics. The second technique, consisting of the run-time coupling of a circuit simulator and a finite-element thermal solver, is based on an application program interface (API) that synchronizes the transfer of information between the two. Through this technique, simultaneous simulation of electrical, thermal and electromagnetic interactions has been achieved

Published in:

Electrical Performance of Electronic Packaging, 1999

Date of Conference:


Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.