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Electrical characterization of S/390 MCM packages from S-parameter measurements below 3 GHz

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3 Author(s)
Ktata, F. ; Lab. fur Inf. Technol., Hannover Univ., Germany ; Arz, U. ; Grabinski, H.

In this work, we investigate the electrical performance of critical signal paths in IBM S/390 MCM packages. We present lumped RLC-models suitable for standard circuit simulators operating in the time domain, e.g. SPICE. The models are developed from finite element simulations of typical signal path segments. By comparing S-parameters from simulations of the models to two-port network analyzer measurements, we validate the models in a frequency range up to 3 GHz

Published in:

Electrical Performance of Electronic Packaging, 1999

Date of Conference:

1999