By Topic

Numerical analysis of fine lead bonding-effect of pad mechanical properties on interfacial deformation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Takahashi, Y. ; Joining & Welding Res. Inst., Osaka Univ., Japan ; Inoue, M. ; Inoue, K.

The present study was carried out for the purpose of understanding solid state inner and middle lead bonding, especially the effect of pad mechanical properties on the interfacial deformation processes between lead and pad based on a computer simulation that was carried out by using a finite element method (FEM). As the mechanical properties largely depend on temperature, we discuss the influence of temperature on the effect of pad mechanical properties, i.e., the pad temperature is different from the lead temperature. It is suggested that the interfacial extension reaches greater than 20% for only 10% lead reduction as the pad temperature is 200 K higher than the lead temperature. We further discuss the effect of the substrate temperature on the bond strength, based on the calculated and experimental results

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:22 ,  Issue: 4 )