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Fault modeling and simulation for crosstalk in system-on-chip interconnects

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4 Author(s)
Cuviello, M. ; Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA ; Dey, S. ; Xiaoliang Bai ; Yi Zhao

System-on-chips (SOCs) using ultra deep sub-micron (DSM) technologies and GHz clock frequencies have been predicted by the 1997 SIA Road Map. Recent studies, as well as experiments reported in this paper, show significant crosstalk effects in long on-chip interconnects of GHz DSM chips. Recognizing the importance of high-speed, reliable interconnects in GHz SOCs, we address in this paper the problem of testing for glitch and delay errors caused by crosstalk in buses and interconnects between components of a SOC. Since it is not possible to explicitly test for all the possible process variations and defects that can lead to crosstalk errors in SOC interconnects, we present an abstract model, Maximum Aggressor (MA) fault model, and its test requirements. The attractiveness of the model is that it can abstract crosstalk defects in interconnects with a linear number of faults, while the corresponding MA tests provide complete coverage for all level defects related to cross-coupling capacitance the interconnects. A SPICE-level fault simulation methodology is presented which allows simulation of a small subset of the potentially exponential number of defects. The simulation methodology also enables validation of the proposed fault model and the resulting test set.

Published in:

Computer-Aided Design, 1999. Digest of Technical Papers. 1999 IEEE/ACM International Conference on

Date of Conference:

7-11 Nov. 1999