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Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

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3 Author(s)
Yeh, J.-L.A. ; Cornell Univ., Ithaca, NY, USA ; Hongrui Jiang ; Tien, N.C.

This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining

Published in:

Microelectromechanical Systems, Journal of  (Volume:8 ,  Issue: 4 )