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Improving throughput in 0.25 /spl mu/m technology development and manufacturing - CVD TiN liner barrier applications

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5 Author(s)
Brennan, B. ; Adv. Micro Devices Inc., Austin, TX, USA ; Rivera, W. ; Christian, C. ; Kin Sang Lam
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During 0.25 /spl mu/m process development and transfer, functional yields were not obtained until the CVD TiN liner barrier process applications were used at five of the six barrier-levels. The process transfer and capital equipment plan did not comprehend this required technology improvement, resulting in these CVD TiN tools becoming a constraint. Aggressive capital equipment installations and manufacturing technology initiatives were implemented to provide the needed capacity to support the ramp plan. Integrated CVD TiN focus teams were sanctioned and chartered to improve the operation productivity. These efforts and results eliminated this tool set from becoming a technology or capacity constraint.

Published in:

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Date of Conference:

11-13 Oct. 1999