Referenced Items are not available for this document.
This paper presents work done during the technology development phase in Intel. The goal was to achieve capability and cost effectiveness for high volume manufacturing of Pentium II(R) processors. The work addressed problems in wafer testing of high-speed microprocessors. These problems stem from the phenomenon of resistance increase between probes and pads during the probing process (contact resistance). This work eliminated the root cause of probing process problems using an innovative approach of Fab process improvement. The result was a robust probing process on time for introduction of the product line. Harnessing technology development for high manufacturability saved many millions of dollars during high volume production of WireBond tight pitch, high-speed microprocessors
Published in:
Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on
Date of Conference: 1999
- Page(s):
- 217 - 219
- Meeting Date :
- 11 Oct 1999-13 Oct 1999
- ISSN :
- 1523-553X
- Print ISBN:
- 0-7803-5403-6
- INSPEC Accession Number:
- 6529164
- Conference Location :
- Santa Clara, CA
- Digital Object Identifier :
- 10.1109/ISSM.1999.808775
- Product Type:
- Conference Publications
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