By Topic

Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Sakai, K. ; Tokyo Seimitsu Co. Ltd., Japan ; Doy, T.K. ; Touzov, M.M. ; Satoh, M.
more authors

This study presents the development of a novel air-back polishing carrier with an integrated Linear Variable Differential Transformer Endpoint Detector (LVDT EPD). In the course of this study, uniformity evaluation was performed on blanket PETEOS oxide and blanket copper wafers and dishing/erosion multi-step polish on patterned wafers. Employment of an air-back polishing carrier resulted in non-uniformity <3% 1σ. The LVDT EPD showed an excellent S/N ratio. The combination of LVDT EPD and air-back polishing carrier significantly enhanced the process performance in Cu CMP

Published in:

Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on

Date of Conference:

1999