Cart (Loading....) | Create Account
Close category search window
 

Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Diaz-Alvarez, E. ; Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA ; Krusius, J.P.

Estimation of wiring and routability requirements for high density substrates is crucial for the development of new technologies, design, CAD tools, and optimization. This paper describes a new approach to wireability estimation that goes beyond Rent's rule. This approach depends on data flow and placement information available at early stages of the design process. Bus and random wiring are modeled explicitly. Excellent overall agreement is demonstrated between our predictions and published wiring data for two MCM systems. The relationship between placement and wireability will be presented through an optimization study by taking wiring parameters and their distributions as metrics. The application of this approach to the estimation of the required signal layers will be demonstrated

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 4 )

Date of Publication:

Nov 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.