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Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

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2 Author(s)
Diaz-Alvarez, E. ; Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA ; Krusius, J.P.

Estimation of wiring and routability requirements for high density substrates is crucial for the development of new technologies, design, CAD tools, and optimization. This paper describes a new approach to wireability estimation that goes beyond Rent's rule. This approach depends on data flow and placement information available at early stages of the design process. Bus and random wiring are modeled explicitly. Excellent overall agreement is demonstrated between our predictions and published wiring data for two MCM systems. The relationship between placement and wireability will be presented through an optimization study by taking wiring parameters and their distributions as metrics. The application of this approach to the estimation of the required signal layers will be demonstrated

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 4 )