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Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

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2 Author(s)
Kwang-Lung Lin ; Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan ; Yi-Cheng Liu

Materials interaction, shearing strength, and bump growth of Al/Cu/electroless nickel/Sn-Pb solder bumps were investigated with respect to reflow conditions. Shearing strength of the solder bump is as high as 64 g/bump for a bump pad dimension of 100×100 μm. Reflow temperature enhances the shearing strength while repeating reflow downgrades the shearing strength to a lowest value of 35 g/bump. A greater bump height is achieved when reflow was conducted at a slower heating rate. Cu penetrates the electroless nickel (EN) layer after reflow, while Al remains unmoved. The diffusion behavior of Cu through the EN layer is discussed. Ni-Sn and Cu-Sn intermetallic compounds form during reflow

Published in:

IEEE Transactions on Advanced Packaging  (Volume:22 ,  Issue: 4 )