Cart (Loading....) | Create Account
Close category search window

Coefficient of thermal expansion of encapsulants-is it always a constant?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)

The mismatch between encapsulants and the printed-circuit board, the components, and even the potting shell or can due to thermal expansion and contraction, particularly if the encapsulant expansion rate is not constant, is treated. The coefficient of thermal expansion (CTE) and glass transition temperature are defined. Problems that arise because not all CTE values are reported the same way or the wrong temperature was used are discussed. The more basic problems that occur because of a lack of understanding of what CTE is and what effects it are examined.<>

Published in:

Electrical Insulation Magazine, IEEE  (Volume:4 ,  Issue: 5 )

Date of Publication:

Sept.-Oct. 1988

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.