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Three-dimensional spatiokinetic distributions of sputtered and scattered products of Ar+ and Cu+ impacts onto the Cu surface: molecular dynamics simulations

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2 Author(s)
C. F. Abrams ; Dept. of Chem. Eng., California Univ., Berkeley, CA, USA ; D. B. Graves

Energy and angular distributions of reflections and sputtered atoms are essential inputs for feature profile evolution simulations. Molecular dynamics simulations are used to compute the three-dimensional energy and angular distributions for reflected and sputtered products when both Ar+ and Cu+ ions bombard a copper surface. We term these “spatiokinetic” distribution functions (SKDF's). We show by example that SKDF's for reflected Ar+ ions focus as the incident angle θi (normal=0°) is increased from 60-75° and broaden as the incident energy Ei is increased from 55-175 eV. We show that the SKDF's for glancing-angle reflected Cu+ ions focus when Ei is increased from 55-175 eV. We show that the SKDF's for copper atoms sputtered by 175 eV Ar+ are insensitive to θi;. We report total sputter yields for Ar+ and Cu+ ions at 55 and 175 eV for incident angles between 0° and 85°, and sticking probabilities for Cu+ ions for these energies and angles. Comparison to representative experimental results (Doughty et al., 1997) is given

Published in:

IEEE Transactions on Plasma Science  (Volume:27 ,  Issue: 5 )