By Topic

Crosstalk in ultra-high-speed VLSI interconnects due to substrate-conductivity, temperature, and line-length effects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Malisuwan, S. ; Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA

Effects of substrate-conductivity, temperature, and line-length on crosstalk along ultra-high-speed VLSI interconnects are investigated. Results indicate that the crosstalk does not decrease monotonically with increasing linespacing and also the crosstalk tends to be more oscillatory when the line-length is increased. The crosstalk amplitude is significantly changed when temperature is varied between 265 to 280 Kelvin for 10-50 mm line-length. Furthermore, the crosstalk is eliminated when substrate-conductivity is greater than 0.14 Siemen/meter and temperature is less than 265 K

Published in:

Communications, Computers and Signal Processing, 1999 IEEE Pacific Rim Conference on

Date of Conference:

1999