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Using neural networks and 3D polynomial interpolation for the study of probe yield vs. E-test correlation. Application to sub-micronics mixed-signal technology

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3 Author(s)
Montull, J.I.A. ; Microelectron. Group, Lucent Technol., Madrid, Spain ; Ortega, C. ; Sobrino, E.

In the present paper we propose the use of neural networks for statistical modelling of data, as well as the use of 3D surface in order to visualise results in a very intuitive way. The scope of the paper is to present a method for extracting qualitative information from the confrontation of yield and E-test data in order to easily identify best process conditions and potential process marginality issues. The neural network approach is a new way to face determining the huge amount of raw data that yield analysis involves in the microelectronics industry

Published in:

Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI

Date of Conference:

1999

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