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Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

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4 Author(s)
Tanaka, N. ; Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan ; Kitano, M. ; Kumazawa, T. ; Nishimura, A.

We have determined the influence of moisture soaking conditions on true adhesion strength measured by our previously developed method. The drop in true adhesion strength of a specimen that absorbed moisture at 50°C is about 50% less than that of a specimen at 85°C. This result suggests that the true adhesion strength depends on not only the moisture content but also the moisture absorption temperature. Therefore, we think that the general moisture condition (85°C/85%) causes more damage to plastic integrated circuit (IC) packages than that of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted interface delamination agrees well with the experimental data for moisture-soaked packages

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Components and Packaging Technologies, IEEE Transactions on  (Volume:22 ,  Issue: 3 )