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Adaptive fuzzy process control of integrated circuit wire bonding

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2 Author(s)
Kinnaird, C.D. ; Semicond. Group, Texas Instrum. Inc., Dallas, TX, USA ; Khotanzad, A.

One step in the assembly of integrated circuits is wire bonding, requiring expert knowledge to optimize critical process characteristics. This paper describes a fuzzy logic controller which sets parameters for the wire bonding process for gold ball wire bonds, specifically controlling bonded ball diameter and shear strength density. While the focus is on control of ball bonds, the method is general and may be applied to other bonding methods with minor modifications. The design of the fuzzy engine and the development of rules based on both operator experience and textual sources are discussed. An adaptation technique is developed to tune the controller's membership functions based on the measured results of the process. The controller has been tested on actual devices in an industrial setting; results show improved process control in terms of consistency and reduced operator adjustment

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Electronics Packaging Manufacturing, IEEE Transactions on  (Volume:22 ,  Issue: 3 )